Related Subjects: Author Index
Book reviews for "Pecht,_Michael_G." sorted by average review score:
Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
Published in Hardcover by Wiley-Interscience (06 February, 1995)
Authors: Michael Pecht, Luu T. Nguyen, Edward B. Hakim, and Michael G. Fecht
Amazon base price: $225.00
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Average review score:

extremely well-written book.
Plastic Encapsulated microelectronics book is one of the very few well-organized and informative books in this area. Excellent references, lots of Tables for any new design and developmental work. Very practical and should be a bible for PEM designer. The book is very easy to read. The never loses his objective to give just right and appropriate information...

Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
Published in Hardcover by CRC Press (24 April, 1997)
Authors: Pradeep Lall, Michael G. Pecht, and Edward B. Hakim
Amazon base price: $69.95
Used price: $42.00
Average review score:
No reviews found.
The Electronics Industry Research Set (Asian Series)
Published in Hardcover by CRC Press (15 June, 1999)
Author: Michael G. Pecht
Amazon base price: $133.50
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Guidebook for Managing Silicon Chip Reliability
Published in Hardcover by CRC Press (29 December, 1998)
Authors: Michael G. Pecht, Riko Radjojcic, Riko Radojcic, and Gopal Rao
Amazon base price: $84.95
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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines : A Focus on Reliability
Published in Hardcover by Interscience (1994)
Author: Michael G. Pecht
Amazon base price: $140.00
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Placement and Routing of Electronic Modules
Published in Hardcover by Marcel Dekker (12 March, 1993)
Author: Michael G. Pecht
Amazon base price: $175.00
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Published in Paperback by Interscience (1994)
Authors: Michael G. Pecht, Abhijit Dasgupta, John W. Evans, and Jillian Y. Evans
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Semiconductor Packaging : A Multidisciplinary Approach
Published in Paperback by Interscience (18 March, 1997)
Authors: Robert J. Hannemann, Allan D. Kraus, and Michael G. Pecht
Amazon base price: $110.00
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Soldering Processes and Equipment
Published in Hardcover by Interscience (04 June, 1993)
Author: Michael G. Pecht
Amazon base price: $110.00
Used price: $68.82
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Related Subjects: Author Index

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